Enhanced Ball Shear Testing Configuration For Substrate LGA Sensor Devices
Richard G. Mariano *
Back-End Manufacturing and Technology, STMicroelectronics, Inc., Calamba City, Laguna, 4027, Philippines.
Marciano M. Maniebo
Back-End Manufacturing and Technology, STMicroelectronics, Inc., Calamba City, Laguna, 4027, Philippines.
Frederick Ray I. Gomez *
Back-End Manufacturing and Technology, STMicroelectronics, Inc., Calamba City, Laguna, 4027, Philippines.
*Author to whom correspondence should be addressed.
Abstract
Semiconductor assembly mass production environment has means of testing and verifying bond consistency and reliability during wire bonding. Common bond integrity assessment is ball shear testing (BST). This test enables analysis of the strength between the bond pad and a ball bond. This paper presents significant procedure on how ball shear testing parameters should be treated during wirebond integrity check. Device complexity in terms of performing ball shear testing specifically on sensor dice has different output responses. Frequent shearing on die resulted as bond pads are elevated by 30 µm (microns). To address manufacturing in-process controls challenges, shearing tool position, dage settings, and optical scopes are taken into consideration. Also, a study was performed on the execution correctness in combination with proper dage parameters was explored to meet good ball shear test process capability and break modes.
Keywords: Ball shear test, bond pad, LGA, sensor die, substrate, wirebond process