Innovative and Robust Application of Automation for Unit Level Traceability on Dual Die configuration of Micro Electromechanical System Products
Journal of Engineering Research and Reports,
Strip mapping for unit level traceability on die attach process of semiconductor companies provide quality driven impression for end users on the market. On processing of Micro electromechanical system packages, strip map generated by operators manually, certain errors and discrepancies are encountered and inevitably experienced by the production line. This causes misleading analysis on manufacturing problems and may lead to inappropriate and incorrect solutions hurting the process line. The application of modern technology and internet of things have been considered as an improvement. This is to eliminate human intervention errors caused by manual practice and promoted fool proof design of procedures. Having a user-friendly application with integration of modern technology drives significant improvement provide benefits to both supplier and customer of the manufacturing world.
- Strip mapping
- micro electromagnetic systems
- Die attach process
How to Cite
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Jerry Secrest “Die Traceability: Upgrading strip and wafer-level packaging”.
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