Elimination of Non-stick on Leads Defect through Re-designed WCTP
Journal of Engineering Research and Reports,
This paper presents the reformation and fabrication resolved on the wire clamp and top plate (WCTP) design to eliminate the presence of lead finger bouncing resulting to high rejection of non-stick on leads (NSOL). Problem experienced was that the hollow or half-etched portion of the leadframe at the top and bottom units caused its bouncing effect. With the aim to improve localized massive NSOL defect, WCTP has been modified to provide positive bias to support its hollow part or the half-etched part of the leadframe at the top and bottom of the units. The re-designed WCTP was fabricated, extending its clamping with enhanced vacuum on top and bottom rows. The implementation of the improved WCTP design reduced the defect with 88 % improvement with the defect reduction during the lot runs.
- non-stick on leads
- wire clamp and top plate
How to Cite
Dresbach C, et al. Local hardening behavior of free air balls and heat affected zones of thermosonic wirebond interconnections. European Micro-electronics and Packaging Conference. Italy. 2009;1-8.
Pulido J, et al. Wirebond process improvement with enhanced stand-off bias wire clamp and top plate. Journal of Engineering Research and Reports. 2020;9(3);1-4.
Younan H, et al. Failure analysis of discolored and nonstick Al bondpad during wafer sorting process. IEEE International Conference on Semiconductor Electronics (ICSE). Malaysia. 2004;1-5.
Sameoto D, et al. Wirebonding characterization and optimization on thick film su-8 mems structures and actuators. TRANSDUCERS 2007 - International Solid-State Sensors, Actuators and Microsystems Conference. France. 2007;2055-2058.
Moreno A, et al. Enhanced loop height optimization for complex configuration on QFN device. IEEE 22nd Electronics Packaging Technology Conference (EPTC). Singapore. 2020;182-184.
Ling J, et al. Wirebond reliability – an overview on the mechanism of formation/growth of intermetallics. Semicon. Singapore; 2008.
Wood L, et al. Plasma cleaning of chip scale packages for improvement of wire bond strength. International Symposium on Electronic Materials and Packaging (EMAP). 2000;406-408.
Angeles A, Arellano IH. Understanding non-stick on lead wirebond failure due to leadfinger surface roughness. International Research Journal of Advanced Engineering and Science. 2019;4(2);49-54.
Tran TA, et al. Fine pitch probing and wirebonding and reliability of aluminum capped copper bond pads. IEEE 50th Electronic Components and Technology Conference (ECTC). USA. 2000; 1674-1680.
Sumagpang Jr. A, et al. Introduction of reverse pyramid configuration with package construction characterization for die tilt resolution of highly sensitive multi-stacked dice sensor device. IEEE 22nd Electronics Packaging Technology Conference (EPTC). Singapore. 2020; 140-146
Dresbach C, et al. Local hardening behavior of free air balls and heat affected zones of thermosonic wire bond interconnections. European Microelec-tronics and Packaging Conference, Italy. 2009;1-8.
Abstract View: 58 times
PDF Download: 36 times