Indirect Material Cost Reduction by Eliminating Manual Derailing Process through Process Simplification
Journal of Engineering Research and Reports,
Page 1-12
DOI:
10.9734/jerr/2021/v20i517305
Abstract
This paper will discuss how to reduce (IDM) Indirect Material consumption for derailing process by eliminating the manual derailing method as part of cost saving project. It involves the removal of cutter blade used for derail.Cost improvement was one of organizational goals of the company for 2019. This drive can be supported by analyzing Indirect Material spending and process simplification at assembly plant. At assembly End-Of-Line processes, derail cutter blade was one of the top Indirect Material spending at singulation and there is an opportunity to reduce if not eliminated the cost consumption of derail cutter blades through process simplification. Increasing volume in Quad-Flat-No lead (QFN) packages and new banner products being develop by New Product Integration NPI, Q1’20 means increase in IDM consumption per process. The challenge is to drive a process simplification that will reduce IDM to save cost by start of Q2’20. DMAIC methodology was used to improve the process of derailing process.
Keywords:
- Derailing
- singulation
- derail cutter
- cutter blades.
How to Cite
References
Yousef Gholipour Kanani. Study and analysis of control phase role for increasing the Success of six sigma projects. IEEE International Conference on Management of Innovation and Technology; 2006 .
Adam Henshall. DMAIC: The Complete Guide to Lean Six Sigma in 5 Key Steps; 2017.
IEEE Guide for Terms and Concepts in Intelligent ProcessAutomation. IEEE Std 2755-2017. Year: 2017 | Standard | Publisher: IEEE
Allam Maalla. Development Prospect and Application Feasibility Analysis of Robotic Process Automation. IEEE 4th Advanced Information Technology, Electronic and Automation Control Conference (IAEAC); 2019.
Jianmin Xie, Futian Li. Study on innovative method based on integrated of Triz and Dmaic. International Conference on Information Management, Innovation Management and Industrial Engineering; 2009.
A. Agarwal S, Mohanraj CS, Premachandran J. Singh. Process technique for singulating fragile devices. 7th Electronic Packaging Technology Conference; 2005.
Qiuxiao Qian;Yong Liu;Scott Irving;Hua Yang;Yang Zhang. simulation and analysis for lead frame bending impact to assembly singulation process. 7th International Conference on Electronic Packaging Technology; 2006.
Srinivas Rao D, Krishnaiah A, Krishna Y. Syed AdilOptimization of cutting parametersfor improved machining of Fe-Al alloy. IEEE; 2017. I2CT. 2017; 8226317.
-
Abstract View: 66 times
PDF Download: 34 times