Addressing Delamination through Advanced Semiconductor Die Design
Journal of Engineering Research and Reports,
Page 142-146
DOI:
10.9734/jerr/2021/v20i417303
Abstract
Innovations and breakthroughs are continuously driven in semiconductor manufacturing to overcome existing assembly limitations and recurring difficulties. This paper is focused on the resolution of the delamination issue during die attach assembly process. A new design of semiconductor die is presented to establish a robust adhesion or interface bonding between the silicon die and the epoxy material for die attach. The paper also provides the specialized design of manufacturing flow for the improved die design through advanced wafer fabrication method and wafer cutting technique. The realization of the advanced silicon die design would ultimately mitigate the delamination issue and would contribute for a robust die attach assembly process.
Keywords:
- Delamination
- die attach process
- leadframe
- silicon die
- wafer
How to Cite
References
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